(1)HS-AL01 is a specialized active metal brazing (AMB) paste formulated for use with copper cladding on Al2O3 substrates.
(2)HS-AN01 is a specialized active metal brazing (AMB) paste formulated for use with copper cladding on AlN substrates.
(3)HS-SN01 is a specialized active metal brazing (AMB) paste formulated for use with copper cladding on Si3N4 substrates.
This collection of pastes is characterized by an uncomplicated preparation process, outstanding printing properties, effective wettability with ceramics, a low void rate post-soldering, high bonding strength, remarkable resistance to both cold and thermal shock, as well as commendable quality and reliability.
